(1) Appears to be a 4-way junction in the "Analog IC" portion of the SCH

(2) Dashed grey separation lines in the SCH are on layer 95 (Names) instead of layer 97 (Measures)

(3) Not sure if the IO connection SMD pads have the correct prefix in the SCH. Maybe label them as a testpoint?

(4) PIC and AD IC's need a PROD-ID in attributes

(5) Looks like the upper standoffs might overlap with some of the IO connections SMD pads, not a huge deal, but worth mentioning.

(6) There are multiple instances of traces entering pads at an angle, 10uf caps in particular

(7) LED's need name and value elements on their respective layers in the BRD

(8) Appears most of the text is in proportional font instead of vector

That's it!

1. I2C pinout needs to be GND/VCC/SDA/SCL

2. Needs pullup resistors on I2C lines, plus the isolation 3 way jumper

3. Route traces straight out (or straight under) each IC. There are currently 4 traces routed perpendicular to it's pad.

4. Bottom GND pour isolation needs to be 12 mil (currently 0)

5. Need to label board dimensions and standoff positions and diameter

6. Add bottom silk to label all headers

If there's room, maybe on bottom silk too?

You've got two different BOM lists in this repo.

Add it in the schematic so there's an associated symbol

All components need to be replaced with our equivalent in our library.

1. add V max note in schematic for V+ and V-.
2. add polarity silk mark to inverted LEDs
3. ensure the drill on the LEDs are NON-PTH. Check in with Shawn and Bob about how they did this with the touch pad board. It will most likely require a note in the gerbers to ensure GP gets this right.
4. Add comment about PCB color:black in sparkle part for PCB and in the bug.
5. add text label to touch pad symbol in schematic

Thanks!

"M01SMDNS" are unnecessary on headers